| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
of the thickness of the plating. This same condition also applies to gold cup terminals, i.e. all the gold must be removed from within the cups regardless of gold thickness
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
of the thickness of the plating. This same condition also applies to gold cup terminals, i.e. all the gold must be removed from within the cups regardless of gold thickness
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough
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