| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests: Dip and inspect, wetting balance, rotary dip test Simple
| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
assembly to avoid damaging components during assembly. The finishing material of aerospace PCBs should be able to tolerate harsh environments. The most common choices include: Electrolytic nickel and gold. Electrolytic wire bondable gold. Electroless nickel
Blackfox Training Institute, LLC | https://www.blackfox.com/news-events/should-you-use-lead-or-lead-free-solder/
? As its name suggests, lead-free solder is the complete opposite of its lead-based counterpart. Instead of lead, it contains other metals like copper, silver, indium, zinc, bismuth, antimony, tin, or nickel
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