Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
. Corrosion is another issue that manufacturers should consider when making PCBs for aerospace applications. The relatively low cost of copper and high electrical conductivity make this metal a common material in PCSs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. However, issues relating to high rates of copper (Cu) dissolution occurring during the PTH rework process using either SAC305 or 405 alloys may force a change in this concept
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. Lead-free solders typically contain a variety of different metals. Some of the components you may find in lead-free solder include tin, copper, silver, nickel and zinc
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Sn-AG-Cu solder, which is eutectic at 3.9% Ag and 0.6% Cu, exhibits a melting temperature of about 217 deg C. Copper may be difficult to stabilize in this alloy. Nickel-Palladium
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Sn-AG-Cu solder, which is eutectic at 3.9% Ag and 0.6% Cu, exhibits a melting temperature of about 217 deg C. Copper may be difficult to stabilize in this alloy. Nickel-Palladium
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
