Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20061608649
Pan Pac 2020 Program TIME LOCATION 12:00PM - 5:30PM Foyer 2:15PM - 2:55PM Lehua/Hau 2:55PM - 3:35PM Lehua/Hau 3:35PM- 3:50PM Courtyard 3:50PM - 4:25PM Lehua/Hau 4:25PM- 5:00PM Lehua/Hau 5:00PM - 6:00PM Breezeway TIME LOCATION Session 1 - Electrochemical Migration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
) Branch or snowflake-like patterns of metal that grow on surfaces between conductors. It requires a chemical reaction capable of dissolving the metal into a solution of metal ions, which are then redeposited by electro-migration in the presence of an electromagnetic field
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
) Branch or snowflake-like patterns of metal that grow on surfaces between conductors. It requires a chemical reaction capable of dissolving the metal into a solution of metal ions, which are then redeposited by electro-migration in the presence of an electromagnetic field
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
compound layer, which in turn deteriorates the solder joint. Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
compound layer, which in turn deteriorates the solder joint. Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There
| 1 |
