| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Because of this, the gold has to be completely removed so that the solder makes the electromechanical and/or metallurgical bond to the subsurface beneath the gold, which in most cases is Nickel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. The bond of this electroplating is usually not sufficient for screws. The better method, electroless nickel plating, gives an alloy of nickel with up to 15% phosphorous
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
. The maximum and minimum forces are also plotted per cycle so trends can be observed during the experiment. In This Section Bond Tests Ball shear Cavity shear Cold bump pull Die shear IGBT shear testing High strain rate Overhanging die shear Passivation shear Stud pull Vector pull Wedge shear Wire pull
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. On both sides of the joint, indium is anchored to nickel with a protective gold finish. Nickel forms a stable intermetallic bond with indium
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