Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
(Electroless Nickel Immersion Gold): Provides excellent solderability and corrosion resistance. Commonly used for high-reliability applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Flux Types Recommended Use RMA Rosin mildly activated Recommended RA Rosin activated Wets clean surfaces NC No clean Alloy specific (contact EFD
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, David Braun Abstract 22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract 22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Immersion silver surface finish eliminated due to corrosion risk Alternative finish must meet ICT and solderability requirements Investigate several alternatives (OSP, ImSn, ENIG, and LF HASL) PCB laminate may change from what was used on DT and NB products
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements
