| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5027
Effects of Cl2, NO2, Rh and Temperature on Accelerated Silver and Copper Corrosion in Mixed Flowing Gas Test 中文 MEMBERS LOGIN Membership Become a Member
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
: nickel and gold, and hot air solder leveling (HASL). Today, dozens of options for PCB finishes are available, each with their own benefits for different applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Flux Types Recommended Use RMA Rosin mildly activated Recommended RA Rosin activated Wets clean surfaces NC No clean Alloy specific (contact EFD
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Monel Nichrome Nickel Nickel Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Key Recommended Alloy Specific (contact EFD
