| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
ORION Industries | http://orionindustries.com/pdfs/Electrically_conductive_poron.pdf
#180-034 EC-2000 SERIES CONDUCTIVE SILICONES High Performance Foams 171 West St. Charles Road Carol Stream, IL 60188-2081 Tel: 630.784.6200 / Fax: 630.784.6201 www.rogerscorporation.com Technical Data TYPICAL PROPERTIES Test Method Filler Base Polymer Specific Gravity, g/cc Thickness
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. The advantages of electroless over electro nickel are: (1) Uniform in thickness, even in deep recesses; (2) Non-porous; (3) Some ability to obtain higher hardness by baking; and (4) Better adhesion
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/barrel-cost-of-ownership
. Nevertheless, the composition, uniform thickness, and the lack of porosity of the inlay are critical determinants of the quality and thus the length of the working life of the barrel
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2017-09-19
. In addition, the Xaloy® X-8000 encapsulation is double the thickness of standard HVOF-applied coatings. ● Xaloy® X-800® Barrel Inlay , a liner combining a nickel-based alloy with tungsten carbide that provides a high degree of abrasion and corrosion resistance and functions compatibly with the Xaloy® X-8000™
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| http://etasmt.com/cc?ID=te_news_industry,26765&url=_print
. PCB Unlimited offers a great selection of SMT stencils including rework stencils, electroformed stencils and step stencils: The stencil thickness and the geometry of the stencil apertures determine the precise volume of solder paste deposited onto the printed circuit boards
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