Partner Websites: nickel tin platin (Page 1 of 7)

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces

: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

SolderTips: Solderability Issues with Nickle Plated Surfaces | EPTAC

| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/

: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed

) when in Rev E of J-STD-001 it was a process indicator (P2D3)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦

Heller Industries Inc.

Spender der IC-Serie von Unity

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/products/adhesive-dispensing-systems-products/unity-ic-series-dispensers

(vom Controller geliefert) Sensorart 120 Ohm Nickel oder 100 Ohm Platin Unity IC300 Appllikator (singular), Applikatoren (plural) Versorgungsspannung 200-240 VAC, 1 Phase, 50/60 Hz, 700 W

ASYMTEK Products | Nordson Electronics Solutions

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