| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
| https://pcbasupplies.com/thermaltronics-m7bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M7BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m8bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M8BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
