Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Continuing his graduate studies 2017 Stephanie Choquette , Iowa State University Paper: "Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections" Where is she now
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
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