| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
– No drop-in universal no lead paste – work with vendors is critical – Void formations can be an issue in no leads 5°C - 15°C15°C – 35°C“True” Process Window 230°C – 240°C230°C – 240°CMax PCB Temp 225°C – 235°C205°C - 215°CTypical Peak Temperature Range 216
| https://www.eptac.com/ask/soldering-aluminum-wire/
. No wetting, whatsoever, even after cleaning and fluxing. Are there any special techniques for soldering aluminum wire? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/ask/soldering-pth-components-in-line-with-stranded-wire/
. The document you should be referencing though is the J-STD-001 which describes the wetting necessary to make a good solder joint
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