10 no-clean flux residue on connector pins resulting in contact issues results

Partner Websites: no-clean flux residue on connector pins resulting in contact issues (Page 1 of 1)

SolderTip #38: Clean vs No-Clean Fluxes - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-38-clean-vs-no-clean-fluxes/

don’t have to clean an RMA Flux. The flux hardens and can be left on. The problem most people find with it is that it has a dark residue and when we used to use it on Printed circuit boards, the test folks would get upset because it would foul up their test fixtures and test pins

Ask Helena & Leo (8)

| https://www.eptac.com/faqs/ask-helena-leo/page/8

. The excess no-clean flux is located in an Ethernet port connector. The units pass all tests with no issues, however; we have recently had a couple of field returns where it was

FluxJet Precision Drop-Jet Dispenser

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing

  FluxJet Precision Drop-Jet Dispenser - English FluxJet Precision Drop-Jet Dispenser Enables No-Clean Processing and Minimizes Flux Residues Features and Benefits - Precise on-demand drop-jet

ASYMTEK Products | Nordson Electronics Solutions

Identifying and Correcting Solder Bridge Defects | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/

: No solder mask is present between adjacent pads Spacing of pads is too close Residue accumulation on the surface of a printed circuit board or stencil Misalignment during solder paste printing or

Imagineering, Inc.

SolderTips | EPTAC

| https://www.eptac.com/solder-tips/

. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Read Answer Issues of Burnt Flux on Class 3 PCB Assemblies Question

ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

 has returned to room temperature.  k. There shall be no dewetting of the solder on the cable conductor or on the  connector.  l. The supplier shall clean all surfaces with an approved solvent until they  are free from all residual flux and other visible

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. It is also helpful to understand any constraints that may exist. Some constraints at Dell’s EMs include the fact that nitrogen reflow was not widely available and no-clean solder flux was required

Surface Mount Technology Association (SMTA)

Dispense System Service Guide

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf

: DO NOT operate the machine with the back hood open. Bolt the back hood shut before powering on the machine because there are no safety interlocks in that area to prevent access to moving parts. OPERATOR SAFETY

GPD Global

Dispense-System-Service-Guide_22290008G.book

GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf

maintenance or troubleshooting procedures on the dispenser. OPERATOR SAFETY: DO NOT operate the machine with the back hood open. Bolt the back hood shut before powering on the machine because there are no safety interlocks in that area to prevent access to

GPD Global

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no-clean flux residue on connector pins resulting in contact issues searches for Companies, Equipment, Machines, Suppliers & Information

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