Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
were completed utilizing both methods. F. Vacuum and Formic Acid Reflow Testing A formic reflow process does not use an organic flux. Formic acid vapor is injected into the process environment at the oven’s soak zones, and reacts as described previously
Heller Industries Inc. | https://hellerindustries.com/bit_news/heller-industries-commended-by-frost-sullivan-for-delivering-unmatched-customer-value-through-its-reflow-soldering-technology/
Reflow Oven Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO) Have a Special Application
Heller Industries Inc. | https://hellerindustries.com/reflow-news/heller-industries-commended-by-frost-sullivan-for-delivering-unmatched-customer-value-through-its-reflow-soldering-technology/
! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens & Back-end Semiconductor Pressure Curing Oven (PCO 860) Voidless / Vacuum Fluxless / Formic Acid Soldering Have a Special Application
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=38
. Typical ions accounted for have included chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system can provide
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