Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
: Root Cause Analysis & Prevention for Electronics Cheryl Tulkoff $200.00 2014 IPC-A-610 and IPC J-STD-001: Moving From Rev. E to Rev. F Norman Mier and James Barnhart
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
, columns and blogs in several leading industry publications. Registrations are being taken through the SMTA Online Registration System. Webinar: IPC-A-620 “C” to “D” Revision Free for Members! Thursday, July 30th @ 11:00am US Eastern Time Presenter: Norman
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
, columns and blogs in several leading industry publications. Registrations are being taken through the SMTA Online Registration System. Webinar: IPC-A-620 “C” to “D” Revision Free for Members! Thursday, July 30th @ 11:00am US Eastern Time Presenter: Norman
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
@ 11:00am US Eastern Time Presenter: Norman Mier, Mastor Instructor (MIT), BEST Inc. Overview For those involved with wire harnesses connected to PCBs the requirements of the IPC/WHMA A-620 document provides the acceptance criteria for wire and cables
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
Components and Packaging Technologies, vol. 26, no. 4, 724-732, December 2003. [10] Muffadal Mukadam, Norman Armendariz, Raiyo Aspandiar, Mike Witkowski, Victor Alvarez, Andrew Tong, Betty Phillips, and Gary Long, “Planar Microvoiding in Lead-Free Second-Level
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Components and Packaging Technologies, vol. 26, no. 4, 724-732, December 2003. [10] Muffadal Mukadam, Norman Armendariz, Raiyo Aspandiar, Mike Witkowski, Victor Alvarez, Andrew Tong, Betty Phillips, and Gary Long, “Planar Microvoiding in Lead-Free Second-Level
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Components and Packaging Technologies, vol. 26, no. 4, 724-732, December 2003. [10] Muffadal Mukadam, Norman Armendariz, Raiyo Aspandiar, Mike Witkowski, Victor Alvarez, Andrew Tong, Betty Phillips, and Gary Long, “Planar Microvoiding in Lead-Free Second-Level
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