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Circuit Delaminations - Application Note 53 Sample & Method The attachment of an IC to a flex circuit was imaged from the back side of the flex
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Sink Attach - Application Note 355 Acoustic image showing head sink and adhesive, no significant defects. Sample & Method A flip chip having an adhesively attached heat sink was imaged from the top side at 100 MHz
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Solar Panel Bondtesting Application Note Nordson DAGE Dage - Micronas Case Study Nordson DAGE Dage - Orthodyne Case Study Nordson DAGE Testing Stent Quality with Prospector Nordson DAGE Micro Testing
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Contact Global HQ Africa Asia Central and South America Europe USA and Canada Torsion Testing Products Content Your results for: Torsion Testing Micro Fracture of Glass Composites using Hot Probe Attach Application Note Nordson DAGE Hot Bump Pull/Hot Pin Pull Application Note Nordson DAGE Bondtesting of Memory Devices Nordson
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& Packaging Presents Nordson DAGE with Editor's Choice Award for 4000 Optima Bondtester Nordson DAGE Presented to Nordson DAGE at Productronica 2013 USB Connector Testing Application Note 2019 Nordson
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. Products Content Your results for: Vector Pull Technical Papers - Bondtesting Nordson DAGE Hot Bump Pull 10kg Load Cartridge Datasheet Nordson DAGE First Bond Ball and Stud Bump Pull for Copper Interconnects Application Note Nordson
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. Products Content Your results for: Industrial & Machinery Hot Bump Pull 10kg Load Cartridge Datasheet Nordson DAGE Image Capture System Datasheet Nordson DAGE Creep testing of Tin Based Alloys Application Note Nordson DAGE Nordson DAGE Purchasing
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. Mfr. Part No : 1-1469491-3Fp.jpg Odd Mounting Hole : Note 4 indicates that there is... Author: budnoelSubject: 496Posted: 14 Aug 2012 at 9:04amNote 4 indicates that there is a pad on top and bottom of pcb but it doesn't give the size
