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Paddle Delaminations - Application Note 2250 VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016 HEAD SINK AND ADHESIVE Nordson SONOSCAN
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[5:00 pm EST] Checkout, March 26 – April 10 2020 (excluding National Holidays) Note, All equipment needs to be removed before the deadline. Location
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. Sonoscan's Acoustic Micro Imaging (AMI) techniques detect these… LEAD AND PADDLE DELAMINATIONS Nordson SONOSCAN SOJ Lead and Paddle Delaminations - Application Note 2250 VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects
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. Products Content Your results for: Acoustic Inspection Systems Acoustic Impedance Polarity Detector (AIPD)™ Nordson SONOSCAN PBGA 3D AMI Nordson SONOSCAN PBGA 3D Acoustic Microscope Image - Application Note 202 AW SERIES C‑SAM®
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thumbnail import feature. TO USE: (Note below are a few screenshots to give an overview understanding of the Gerber Preview thumbnail import feature
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. The 4000HS has significant differences to the mode of operation for both… Overcoming Passivation Layer Interference in Ball Shear Testing Application Note Nordson DAGE Ribbon Testing Application Note Nordson DAGE Technical Papers - Bondtesting Nordson DAGE Composite
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: ASTM D790 and D6272 IPC-TM-650 SEMI G86-0303 JEDEC 9702 Download application note Download fixture Datasheet Products Content Your results for
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. Three and four point and spherical bending can be performed with sample sizes as small as a 1mm square. Download application note Products Content Your results for