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. Tech Magazine, February 2013) (133 KB) Underfill Dispensing for Chip On Wafer, presented at CSTIC 2017 Nordson ASYMTEK A. Morita, W. Gu, and B. Chung (CSTIC, March 2017, Shanghai
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: Electronics - Assembly and Packaging Advantages of Non-Contact Dispensing in SMT Assembly Processes Nordson ASYMTEK A. F. Piracci (SMTA/ATE, Chicago, IL, September 2000) (PDF 91 KB
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