PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-18-released_topic2998.html
V2021.17 that caused regression for all FP Designer footprint silkscreen outlines Calculators: The master options value for Paste Mask is for Annular Ring and it was set to oversize instead QFP w/Thermal Add Fiducials changed the thermal pad pin number Axial Lead family
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-18-released_topic2998_post11961.html
V2021.17 that caused regression for all FP Designer footprint silkscreen outlines Calculators: The master options value for Paste Mask is for Annular Ring and it was set to oversize instead QFP w/Thermal Add Fiducials changed the thermal pad pin number Axial Lead family
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2998&OB=ASC.html
V2021.17 that caused regression for all FP Designer footprint silkscreen outlines Calculators: The master options value for Paste Mask is for Annular Ring and it was set to oversize instead QFP w/Thermal Add Fiducials changed the thermal pad pin number Axial Lead family
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-name-for-parts-with-tabs_topic494.html
. The original IPC-7351 footprint naming convention does not include component tolerances, thermal pad sizes, BGA Ball sizes or various pin assignments into account
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-name-for-parts-with-tabs_topic494_post2055.html
. The original IPC-7351 footprint naming convention does not include component tolerances, thermal pad sizes, BGA Ball sizes or various pin assignments into account
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic494&OB=ASC.html
. The original IPC-7351 footprint naming convention does not include component tolerances, thermal pad sizes, BGA Ball sizes or various pin assignments into account
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. QFNs are very space efficient and are often used where the PCBA size must be minimal. QFN devices usually feature a large cooling pad underneath, ideal for applications where good thermal performance is required
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351b-land-pattern-naming-convention-flaws_topic2336.html
- QFN25P40_400X300X80L40X20 T265 Another issue is the BGA component family. If all the BGA dimensions are the same except the Baal Diameter ranges from 0.30 - 0.50 the IPC Calculator would produce a duplicate land pattern name for every BGA even though the Pad Size would be different
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2336&OB=ASC.html
- QFN25P40_400X300X80L40X20 T265 Another issue is the BGA component family. If all the BGA dimensions are the same except the Baal Diameter ranges from 0.30 - 0.50 the IPC Calculator would produce a duplicate land pattern name for every BGA even though the Pad Size would be different
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1974&OB=ASC.html
> Regenerate Library > Names” Added the DPAK Thermal Tab data to the Footprint Name SON with Thermal Tab produced an incorrect Thermal Pad when building the footprint in Batch Build
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