PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
% area reduction in the thermal pad of a QFN package. 3. Maybe it is not directly your advice but somewhere I red about putting solder mask on these thermal via to avoid solder paste wicking. 4. The solderdam
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2017-20-released_topic2250.html
, the highlight of the selection appears in the new part Fixed an issue with BGA & LGA for single pin parts throwing an erroneous error message and not producing the pad Fixed an issue with the SOTFL Transistor component family, the thumbnail image with the packages dimensions was
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2017-20-released_topic2250_post9307.html
, the highlight of the selection appears in the new part Fixed an issue with BGA & LGA for single pin parts throwing an erroneous error message and not producing the pad Fixed an issue with the SOTFL Transistor component family, the thumbnail image with the packages dimensions was
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2250&OB=ASC.html
, the highlight of the selection appears in the new part Fixed an issue with BGA & LGA for single pin parts throwing an erroneous error message and not producing the pad Fixed an issue with the SOTFL Transistor component family, the thumbnail image with the packages dimensions was
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-09-released_topic2951.html
– in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2951&OB=DESC.html
– in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-expert-2021-09-released_topic2951_post11769.html
– in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2951&OB=ASC.html
– in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules
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