Lewis & Clark | http://www.lewis-clark.com/shop/page/3/
: Nordson Yestech Model: YTV-FX Vintage: 2011 Condition: Complete & Operational Location & Shipping: USA / EXW Origin Availability: Immediate for purchase / 4-6 weeks for shipping Please contact us for addtional information and pricing 2011 Nutek NTM650-SL LIFO Buffer with
| https://www.smtfactory.com/I-C-T-3D-Aoi-Optical-Inspection-Machine-For-Pcb-pd49400944.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
| https://www.smtfactory.com/I-C-T-SMT-off-line-Aoi-inspection-machine-For-Pcb-I-C-T-V8-pd48670624.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6006.html
KOHYOUNG NUTEK OTHER PARTS CONTACT US welcome to KD Electronic Equipment Accessories Product number:ASM Accessories2 Description: 00315063-01TAPE CONTAINER SIPLACE 8000315132S03PROTECTION RING00315167-02Component-Magazine long W8,5/H2,8/E-L1500315209-01FILTER MAT 230
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40301648-n606hckfs053-panasonic-bm123-z-axis-motor-bm123-motor-hc-kfs053.html
ｶﾒﾗ CAMERA 1086109520 ﾉｽﾞﾙﾎﾙﾀﾞﾕﾆｯﾄ NOZZLE HOLDER UNIT 1 ﾌﾟｯｼｬ PUSHER 1 ﾎﾙﾀﾞ HOLDER N210047269AA ｻﾞｶﾞﾈ WASHER 1080709514 ﾊﾟｯﾄﾞ PAD 1080709925 ﾊﾞﾈ SPRING XUC8FP E ｶﾞﾀﾄﾒﾜ RETAINING RING E-TYPE N506D2
| http://etasmt.com:9060/te_news_bulletin/2020-12-18/21361.chtml
, (this temperature is also called the peak temperature) for about 5-10 /S In the reflow zone, the solder paste melts quickly and wets the pad quickly
| http://etasmt.com:9060/te_news_industry/2021-08-31/23962.chtml
. Also, low solder volume can cause solder defects. Is the stencil designed for the PIP process? To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation
| http://etasmt.com/te_news_industry/2021-08-31/23962.chtml
. Also, low solder volume can cause solder defects. Is the stencil designed for the PIP process? To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation
| https://www.smtfactory.com/I-C-T-V5000H-3D-AOI-Optical-Inspection-Machine-For-PCB-pd49400944.html
LV Series Vacuum Reflow Oven SMT Stencil Printing Machine Semi-auto SMT Stencil Printer Full-auto SMT Stencil Printer Pick & Place Machine SAMSUNG Pick
| https://www.smtfactory.com/I-C-T-V8-SMT-Off-Line-Aoi-Inspection-Machine-For-Pcb-pd48670624.html
LV Series Vacuum Reflow Oven SMT Stencil Printing Machine Semi-auto SMT Stencil Printer Full-auto SMT Stencil Printer Pick & Place Machine SAMSUNG Pick
