Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
(organic solderability preservative). Minimum trace spacing ranges are from 0.005–0.008″. Testing is optional. SMD (surface mount device
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Hard gold is durable and RoHS compliant but also expensive. Organic solderability preservative (OSP) is RoHS-compliant and cost-effective but has a short shelf life
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(Organic Solder Preservative) Leaded Leadfree HAL Soft bondable gold ENIPEG Our RoHS capabilities include: High Tg/High performance FR-4 material Halogen-free solder mask Lead-free surface finishes
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. OSP (Organic Solderability Preservatives): A flat and cost-effective finish that offers good solderability for a limited time after application. VII
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/nitrogen-generators
. The elimination of oxygen prevents oxidation which is the major cause of degradation in the organic solderability coating on circuit boards
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. The test boards were fabricated with Panasonic R-1755V high temperature PCB laminate and Entek HT Plus organic solderability preservative (OSP) final finish
