Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. The inner layers of the PCB will require the additional removal of copper. The manufacturer then cleans each PCB’s layers before aligning the inner and outer layers using the holes previously punched into each layer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, 1.0mm pitch, various solder ball diameters SnPb solder paste Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish Thermal cycling: 0°C-100
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, 1.0mm pitch, various solder ball diameters SnPb solder paste Test vehicle one: 2.36mm thick (93 mil), FR-4, 8 internal planes, OSP finish Thermal cycling: 0°C-100
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to
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