Partner Websites: osp shelve life (Page 1 of 2)

Everything You Need to Know About PCB Finish | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/

. Most finishes will allow for this, with the main exception being organic solderability preservative (OSP). While this type of finish is eco-friendly, low-cost, and simple to manufacture and rework, it has virtually no shelf-life and can be easily damaged

Imagineering, Inc.

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

Paste -Excellent Durability Against Heat Cycle Stress Ideal for extreme environments SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

: 1/03/01 Candidate Alloy Melting Temperatures No Lead Characteristics • Slightly Stronger • Comparable Fatigue Life to 63/37 • Coarser Grain Structure

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

: 1/03/01 Candidate Alloy Melting Temperatures No Lead Characteristics • Slightly Stronger • Comparable Fatigue Life to 63/37 • Coarser Grain Structure

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R

Heller Industries Inc.

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study

Surface Mount Technology Association (SMTA)

Understanding the PCB Fabrication Process: From Design to Delivery

Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/

. Hard gold is durable and RoHS compliant but also expensive. Organic solderability preservative (OSP) is RoHS-compliant and cost-effective but has a short shelf life

Imagineering, Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

(Improved Design Life and Environmentally Aware Manufacturing of Electronic Assemblies by Lead-Free Soldering), and the Japan Electronics and Information Technology Industries Association (JEITA

Heller Industries Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

(Improved Design Life and Environmentally Aware Manufacturing of Electronic Assemblies by Lead-Free Soldering), and the Japan Electronics and Information Technology Industries Association (JEITA

Heller Industries Inc.

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