| https://productronica.com/en/program/live-demonstrations/cleanroom/
. For example, outgassing of plastics can cause significant contamination of the product surface and thus have a negative impact on product quality
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Let’s take a look at the IPC standards. IPC Standards IPC-HDBK-830 – Long Term Reliability and Testing Section 12.1.5 – Bubbles The presence of bubbles in a conformal coating is a factor in air entrapment, outgassing, mixing and/or application methods
Heller 公司 | https://hellerindustries.com.cn/low-void-curing/
低空洞固化 – Heller » 低空洞固化 无空洞加压固化 压力固化炉（PCO）或高压釜用于减少空洞并提高粘合工艺的粘合强度，通常用于芯片粘接和底部填充应用 空洞引起的问题 减少设备与基材的附着力 降低热性能 “焊料蠕变”引起的电气故障 可靠性较低，使用寿命较短 压力固化可去除空洞 随着压力的增加，更多的气体分子能够溶解（亨利定律） 亨利定律 – 液体中溶解气体的量与其高于液体的分压成正比。 在固化过程中增加压力可消除空洞。 超滤中的气泡随着压力的增加而溶解。 电路板 固化介质中的残留气泡随着压力的增加而溶解。 溶解的气体通过扩散效应扩散。 电路板 溶解的气体通过扩散效应扩散到整个介质中。当它到达边缘时，它通过释气逸出。 Dissolved gas escapes at the edges through outgassing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/conformal-coating-materials
. In addition, it is important that the drying occur from the bottom up to avoid entrapment of outgassing solvents, hence IR heat source is most suitable
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
part of this Standard is based on industrial experience and recommendations from European soldering technology experts. Modifications are incorporated into the text to provide for the specific requirement of low‐outgassing
