| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: Air bubbles or voids are in all the solder joints ever made, in one form or another. At times they are filled with flux or soldering tinning fluids and other times they are caused by outgassing and they are simply a void with nothing in them
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to dissolve
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds/thermal-compound
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-glossary
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
5.1.4 Equipment and tools...................................................................................14 5.2 Material selection .....................................................................................................16 5.2.1 Solder
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