Partner Websites: outward facing lead fillet (Page 1 of 1)

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

CF8 Documentation Package Documentation Package for CF-8 Axial Component Lead Former PN 801-1-01 version 2.0 03/22/2021 CONTENTS of CF-8 Documentation Package Operating Guide In addition to installation, set up, and operating procedures, this guide includes electrical schematics and maintenance

GPD Global

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post3020.html

.  It makes sense that the solder would have an affinity for the metal of the pad and lead and so it wouldn't push outward. I'm happy to know there haven't been any assembly issues with regards to solder under component bodies

PCB Libraries, Inc.

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic12&OB=ASC.html

.  It makes sense that the solder would have an affinity for the metal of the pad and lead and so it wouldn't push outward. I'm happy to know there haven't been any assembly issues with regards to solder under component bodies

PCB Libraries, Inc.

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post23.html

.  It makes sense that the solder would have an affinity for the metal of the pad and lead and so it wouldn't push outward. I'm happy to know there haven't been any assembly issues with regards to solder under component bodies

PCB Libraries, Inc.

ECSS-Q-ST-70-18C

| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf

.............................................................................................................42 Figures Figure B-1 : Photograph showing non-captive nut and preferred solder fillet ........................36 Figure B-2 : Microsection through preferred solder fillet, revealing full penetration of solder path

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