Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/how-to-remove-oxidation-from-soldering-iron-tips/
Oxidation From Soldering Iron Tips Poor soldering tip maintenance is a common culprit in most soldering issues. Most of which is caused by a heavy buildup of oxidation on the soldering iron tip’s surface
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/faqs/ask-helena-leo/ask/wet-sponge-cleaning-vs-dry-brass-sponge-cleaning
. This cracking allowed the tin to penetrate the plating on the tip, which prevented the tip from being tinned, thereby increasing the oxidation on the tip, rendering the tip useless and needing to be replaced
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Excessive Heating Rate Preheat Temp Low Solder Paste Oxidation Screen/Stencil Clogged Insufficient Solder Paste Oxidized Solder Paste Paste Viscosity Too Low Misaligned Component Excess Solder Deposition
