6 oxidized leads results

The Need For Gold Removal On Solderable Surfaces 2 The Criteria J-STD-001 – 4.5.1 Gold Removal •  Gold Shall Be Removed: N1P2D3 –  From at least 95% of the surfaces to be soldered of the through-hole component leads with

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

[N1D2D3] be removed: a.  From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 µm [100 µin] or more of gold thickness b.  From 95

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

).     F Fillet Solder formation at the intersection of surfaces of a solder connection.   Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less.   Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

).     F Fillet Solder formation at the intersection of surfaces of a solder connection.   Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less.   Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants

ASYMTEK Products | Nordson Electronics Solutions

Medical Device Manufacturing Plasma Treatment | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/medical

, and treatment of the external electronic leads. Plasma cleans mold release and activates the surface of pacemaker and defibrillator headers to improve the bond between the header and can

ASYMTEK Products | Nordson Electronics Solutions