| http://etasmt.com/te_news_bulletin/2019-09-28/11162.chtml
. The disk isolates the pads and component leads from oxygen. B. When the PCB enters the insulation zone, the PCB and components are fully preheated to prevent the PCB from entering the soldering high temperature zone and damaging the PCB and components. C
| http://etasmt.com:9060/te_news_bulletin/2021-09-03/25363.chtml
motors Multi-level controlled cooling Multi-level process gas cleaning with pyrolysis Rest-oxygen monitoring and control, low N2 consumption Ersa Process Control software (EPC
| http://etasmt.com:9060/te_news_bulletin/2021-09-03/25364.chtml
motors Multi-level controlled cooling Multi-level process gas cleaning with pyrolysis Rest-oxygen monitoring and control, low N2 consumption Ersa Process Control software (EPC
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
. In this work is shown that this behavior results from thicker oxides, which were formed by the influence of high temperatures and oxygen atmosphere
Lewis & Clark | http://www.lewis-clark.com/product-tag/reflow-oven/
: XPM3i-1030 Description: Reflow Oven Vintage: 2013 Details: Windows XP Nitrogen Edge Rail & Mesh Belt Oxygen Analyzer Location & Shipping: USA / FOB Origin Availability
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
. In this work is shown that this behavior results from thicker oxides, which were formed by the influence of high temperatures and oxygen atmosphere
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/about-us/nordson-blog/electronics-solutions-blogs/plasma-surface-preparation
. Surfaces are activated using plasma source gases such as argon, oxygen, hydrogen, or a mixture. The enhanced surface wettability from plasma treatment results in better conformal coating adhesion to high-performance solder mask materials and other difficult-to-adhere-to substrates
| http://etasmt.com/te_news_bulletin/2020-07-20/18161.chtml
. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate. At the same time, the flux in the solder paste wets the pad, component ends and pins, the solder paste softens, collapses, and covers the solder Plate to isolate the pad and component pins from oxygen. B
| http://etasmt.com/te_news_bulletin/2021-09-03/25362.chtml
motors Multi-level controlled cooling Multi-level process gas cleaning with pyrolysis Rest-oxygen monitoring and control, low N2 consumption Ersa Process Control software (EPC
| http://etasmt.com/te_news_bulletin/2021-09-03/25363.chtml
motors Multi-level controlled cooling Multi-level process gas cleaning with pyrolysis Rest-oxygen monitoring and control, low N2 consumption Ersa Process Control software (EPC
