| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-component-tombstone-on-flex-circuit
: Can you tell me if there are other reasons that components tombstone? We have looked at the pad size and the amount of paste on the pads
| http://etasmt.com/cc?ID=te_news_bulletin,23573&url=_print
. PCB Nonwetting is recognized by the fact that the base metal is visible. It is usually due to the presence of contamination on the surface to be soldered
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1086-die-and-lead-delaminations
. Result The numerous red and yellow areas are delaminations of the molding compound from both the die face and the lead fingers. Each of these delaminations is a site where contamination and corrosion leading to electrical failure may occur
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
. Where we get into trouble is when the part floats straight back and the heel of the gull wing leads are no longer on pad. All other criteria meet IPC specifications
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-wires-to-pads-with-a-lap-joint
. We have some strain gauges on an assembly and need to solder wires to the strain gauge pads. We are concerned that we might not be able to get two wires soldered on flat against the pads as the wire is fairly thick compared to the pad
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
