Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
| https://www.eptac.com/faqs/ask-helena-leo/ask/pem-nut-soldering-criteria
. The base of the PEM ® nut should be on a non functional land/pad area on the PCB board to which it can be soldered and the securing hardware should originate on the opposite side of the PCB board
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
. Basically they have to be introduced to the solder pot at an angle and then removed from the solder with a sweeping motion to prevent icicles from forming on the termination pad
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
the glass body of glass bodied components. There are basically two conditions where solder will touch the glass body, one, too much solder on the pad, and two incorrect pad design
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Reliability data using IPC Test Methods and the Bono test data will be presented. Session 3 - Advanced Test Methods + Quantification of ionic contamination present on electronic assemblies is of extreme importance, especially when the end product functions within harsh environments
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23573.chtml
. PCB Nonwetting is recognized by the fact that the base metal is visible. It is usually due to the presence of contamination on the surface to be soldered
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
ASCEN Technology | https://www.ascen.ltd/Products/auto_optical_inspection/515.html
. the A500 model is very suitable for a standard PCB inspection after reflow oven . In addition, the same machine can inspect components on glue including the pad glue contamination
| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml
. PCB Nonwetting is recognized by the fact that the base metal is visible. It is usually due to the presence of contamination on the surface to be soldered
