ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
jetting system help companies to realize increased throughput, improved accuracy and process flexibility. Nordson MARCH Surface Preparation Solutions Plasma processing removes contamination and oxidation during several stages in wafer-level packaging
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
. PCB Nonwetting is recognized by the fact that the base metal is visible. It is usually due to the presence of contamination on the surface to be soldered
| https://www.smtfactory.com/High-Speed-SMT-AOI-Machine-in-PCB-Board-Off-Line-Model-I-C-T-V8-pd48670624.html
. LOG automatic collecting and storage function,NG warning/alarm function, Remote programming&debugging. 2. Inspection ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
| https://www.smtfactory.com/I-C-T-V5000H-SMT-On-line-Automated-Optical-Inspection-AOI-Machine-for-SMT-Line-pd49400944.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Lipstick-Camera-Fixed-Dual-Station-User-Guide-22293052M.pdf
. DO NOT scratch the surface of the glass. • Use lens cleaning paper to clean the lamp lens. • While the camera is not in use, keep the lens or lens cap on the camera to prevent dust or contamination from getting in the CCD area and scratching or damaging this area
GPD Global | https://www.gpd-global.com/pdf/doc/Lipstick-Camera-Fixed-Dual-Station-User-Guide-22293052M.pdf
. DO NOT scratch the surface of the glass. • Use lens cleaning paper to clean the lamp lens. • While the camera is not in use, keep the lens or lens cap on the camera to prevent dust or contamination from getting in the CCD area and scratching or damaging this area
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-white-paper-plasma-clean-to-reduce-wire-bond-failures-now-available
,” explained John Maguire, business manager, Nordson MARCH and author of the white paper. “In practice, there are a number of sources of surface contamination which influence the wire bond statistics and the device reliability
| https://www.smtfactory.com/I-C-T-3D-Aoi-Optical-Inspection-Machine-For-Pcb-pd49400944.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
| https://www.smtfactory.com/I-C-T-SMT-off-line-Aoi-inspection-machine-For-Pcb-I-C-T-V8-pd48670624.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
doesn’t adhere properly to the metal surfaces. In other words, the solder does not "wet" the metal surfaces as it should. This can be caused by several factors that include oxidation, contamination by dirt or grease, or high surface tension
