| https://www.smtfactory.com/I-C-T-V8-SMT-off-line-Aoi-inspection-machine-For-Pcb-pd48670624.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Beam broken between bond and edge of silicon. (d-6) Bond lifted. (d-7) Lifted metallization (separation of metallization) from die, separation of bonding pad. (d-8
| https://www.smtfactory.com/I-C-T-V5000H-3D-AOI-Optical-Inspection-Machine-For-PCB-pd49400944.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
| https://www.smtfactory.com/I-C-T-V8-SMT-Off-Line-Aoi-Inspection-Machine-For-Pcb-pd48670624.html
ability:insufficient,short,slodering hole,solder covering pin,contamination,misalignment,missing part,skewed,billboard,mounting on side,overturn,wrong part,damaged,float,polarity,pseudo soldering,empty solder,excessive glue etc. 3
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
) • Camera to Touchpad (XY) (pg 13) • Camera to Purge Cup 1 (XY); Head1 to Z (pg 13) • Camera to Purge Cup 2 (XY); Head1 to Z (pg 13) • Camera to Purge Cup 3 (XY); Head1 to Z (pg 13) • Camera to Drill Pad (XY) (pg 14) • Camera to Camera Calibration A1 (XY) (pg
GPD Global | https://www.gpd-global.com/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
) • Camera to Touchpad (XY) (pg 13) • Camera to Purge Cup 1 (XY); Head1 to Z (pg 13) • Camera to Purge Cup 2 (XY); Head1 to Z (pg 13) • Camera to Purge Cup 3 (XY); Head1 to Z (pg 13) • Camera to Drill Pad (XY) (pg 14) • Camera to Camera Calibration A1 (XY) (pg
| https://www.eptac.com/faqs/ask-helena-leo/ask/type-of-water-to-use-on-soldering-sponges
. This is why many of the solder iron manufacturers provide a brass pad to clean off the solder, which is to prevent this thermal shock and extend the life of the tip
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/mems?page=4
: • Nordson MARCH advanced plasma surface treatment equipment for device cleaning, photoresist descum, material stripping, redistribution line etching, contamination removal and other applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/mems?page=3
: • Nordson MARCH advanced plasma surface treatment equipment for device cleaning, photoresist descum, material stripping, redistribution line etching, contamination removal and other applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-receives-vision-and-innovation-awards-at-nepcon-china-for-its-rollvia
dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns
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