PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp
PCB Parts on Demand - Part Data LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/
PCB Parts on Demand - Part Data LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales & Support About Us News History Altium Designer CircuitStudio P-CAD Allegro OrCAD Layout OrCAD PCB Board Station PADS Standard PADS Professional Xpedition VX CADSTAR CR-5000 / 8000 eCADSTAR 3D STEP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/mismatch-between-options-and-hkp-data_topic667_post2292.html
Mismatch Between Options and HKP Data - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Mismatch Between Options and HKP Data
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/mismatch-between-options-and-hkp-data_topic667_post2296.html
Mismatch Between Options and HKP Data - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Mismatch Between Options and HKP Data
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic667&OB=ASC.html
Mismatch Between Options and HKP Data - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Mismatch Between Options and HKP Data
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic667&OB=ASC.html
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
assembly process root cause and not related to the absence or presence of voids in the solder joints. Therefore, subsequent data analysis did not include the data for component reference designator U1. BGA 56 - typical voids 0% 10% 20% 30% 40% 50% 60% 70% 80
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
assembly process root cause and not related to the absence or presence of voids in the solder joints. Therefore, subsequent data analysis did not include the data for component reference designator U1. BGA 56 - typical voids 0% 10% 20% 30% 40% 50% 60% 70% 80
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_editing-part-data-in-pads-layout_topic2085.xml
. Editing Part Data in PADS Layout : Hello, I'm working on a large... Author: romrSubject: 2085Posted: 07 Feb 2017 at 12:30pmHello, I'm working on a large BGA that I need to enter X,Y coordinate data on.  
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/how-to-monitor-and-track-height-sense-data
Data How to Monitor and Track Height Sense Data Accurate height sensing is important for consistent dispensing of precise lines and dots because it keeps the valve at the desired distance from the part