ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/news-search/optibond-solutions-nonwovens
.” Nordson’s broad range of OptiBond solutions includes: passive or active metering; point-of-application or intermediate system component
PCB Libraries, Inc. | https://www.pcblibraries.com/products/fpx/3D-STEP.asp
! Our FPX file browser allows you to search the database for the component you need, then simply push a button to automatically generate a high-resolution 3D component package in standard STEP format
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/3D-STEP.asp
! Our FPX file browser allows you to search the database for the component you need, then simply push a button to automatically generate a high-resolution 3D component package in standard STEP format
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/height-difference-between-different-amls_topic11_post16.html
". The Footprint and 3D Model must have the same rotation, name, origin, height, etc. They are synced together. One of the main things that IPC is considering for Footprint Name creation is to add a 2 - 3 character suffix at the end of the name to indicate the component manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic11&OB=ASC.html
". The Footprint and 3D Model must have the same rotation, name, origin, height, etc. They are synced together. One of the main things that IPC is considering for Footprint Name creation is to add a 2 - 3 character suffix at the end of the name to indicate the component manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/height-difference-between-different-amls_topic11_post15.html
". The Footprint and 3D Model must have the same rotation, name, origin, height, etc. They are synced together. One of the main things that IPC is considering for Footprint Name creation is to add a 2 - 3 character suffix at the end of the name to indicate the component manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pqfn-pson-footprint-name_topic305.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pqfn-pson-footprint-name_topic305_post2178.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pqfn-pson-footprint-name_topic305_post2179.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5375 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Oct 2012 at 10:39am The Component Lead Shape and the resulting Pad Shape have nothing to do with the footprint pattern name
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic305&OB=DESC.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
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