| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. In addition, if the viscosity of the solder paste is too low, and the solder paste slump is relatively poor, it is also a solder paste quality problem. (2
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
• Improper application of solder mask • Excessive slump of solder paste Reflow-related causes: • Improper reflow profile for solder paste
