4 pb -free wave results

. –  From the surfaces to be soldered of solder terminals plated with 2.54 µm [100 µin] or more of gold thickness. –  A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component on or in the assembly, either Surface Mount or Plated Through Hole components 2 The Criteria J-STD-001 ES 4.5.1 Gold Removal

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

SMT Parts Ball Spline J90551171A For Samsung SM421/411/431 Z Axis Shaft

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