| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf
Cracking or delamination during reflow tends to be an overstress mechanism and can therefore be described as a stress vs. strength phenomenon
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
>> News Circuit Board Voids & PCB Delamination Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
& PCB Delamination From: Author: Publish time:2021-08-31 17:39 Clicks:16 Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies
| https://www.smtfactory.com/How-to-prevent-static-electricity-during-the-operation-of-the-Full-auto-SMT-Production-Line-id3182659.html
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ASCEN Technology | https://www.ascen.ltd/Products/custom_automatic_machine/pcb_cutting_mach/359.html
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