| https://ipcapexexpo.org/education/call-for-technical-paper-form
Extreme Requirements PCB Fabrication and Materials Quality, Reliability, Test and Inspection Other Assembly Processes Topics BTC/QFN/LGA Assembly Challenges Cleaning Coating Processes Electronics
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
) density and resistance to deleterious electromigration effects. In micro Cu-pillars, SnAg solder is electroplated on top of a Cu pillar
| https://ipcapexexpo.org/education/call-for-participation
) Automated X-ray Inspection (AXI) Failure Analysis In-circuit Testing (ICT) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed. PDC07 Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Cancelled
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
&D Scientist and Engineer, Sandia National Laboratories 2010 Jonathon Tucker , Purdue University (West Lafayette, IN) Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders" Where is he now
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