ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
. Automatic PCB solder paste screen printer with pecial manual lifting platform is simple and reliable structure, low cost, easy to manually adjust, you can quickly achieve different thickness of the
ASCEN Technology | https://www.ascen.ltd/Products/auto_optical_inspection/515.html
Windows 7 Professional Display/Output 22inch TFT LCD System specifications for ASCEN offline automatic optical inspection machine A500 model PCB size 50×50mm(Min)~430×330mm(Max) PCB thickness
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
55971 | https://www.ascen.ltd/ASCEN-smt-conveyor-list.pdf
ASCEN Technology
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. This quantitative composition and thickness information can then be used to provide new levels of insight in PCB and semiconductor inspection, potentially leading the way to a new generation of X
| https://www.eptac.com/solder-tips/
. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Read Answer Issues of Burnt Flux on Class 3 PCB Assemblies Question
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Brazing A method of joining metals that involves the use of a filler metal or alloy that melts over 450° C (842° F) and below the melting temperature of substrate materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Brazing A method of joining metals that involves the use of a filler metal or alloy that melts over 450° C (842° F) and below the melting temperature of substrate materials
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
length pcb = board thickness soh = stand-off height ctc = center to center pdia = pin diameter wdia = wire diameter 5.3.2.1 Horizontal Flush-Mount Form Calculations 1. Use the values below in the following equations/calculations: cst = .015" (.38 mm
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
length pcb = board thickness soh = stand-off height ctc = center to center pdia = pin diameter wdia = wire diameter 5.3.2.1 Horizontal Flush-Mount Form Calculations 1. Use the values below in the following equations/calculations: cst = .015" (.38 mm
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