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PCB Libraries Forum : Via Naming Convention PCB Libraries Forum : Via Naming Convention This is an XML content feed of; PCB Libraries Forum : OrCAD Layout
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Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
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Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
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Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/the-third-ipc-hampoo-cup-chinese-pcb-design_topic1378_post5503.html
, structure, manufacturability, cost, and period should be balanced comprehensively so as to improve the overall standard of the PCB design industry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/the-third-ipc-hampoo-cup-chinese-pcb-design_topic1378.html
, structure, manufacturability, cost, and period should be balanced comprehensively so as to improve the overall standard of the PCB design industry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1378&OB=ASC.html
, structure, manufacturability, cost, and period should be balanced comprehensively so as to improve the overall standard of the PCB design industry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1378&OB=DESC.html
, structure, manufacturability, cost, and period should be balanced comprehensively so as to improve the overall standard of the PCB design industry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1378.html
, structure, manufacturability, cost, and period should be balanced comprehensively so as to improve the overall standard of the PCB design industry
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-for-smd-components_topic1009.html
. I always "Flood Over" every via in a PCB layout expect those that are via-in-pad will have a thermal relief. The via-in-pad vias have to be specially marked on the fabrication drawing as they need to be plated, plugged, capped, surface finish and planerized flat so that you cannot tell if there is a hole or not
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