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Study of BGA Devices - Impact of Interfacial Voiding Implications of Using Lead Free Solders on X-ray Inspection of Flip Chips and BGAs Investigating Voids - Circuit Assembly Article Does PCB Pad
| https://www.smtfactory.com/AXI-Automatic-X-Ray-Inspection-pl3345132.html
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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830