3219 percent of rejected components in smt results

Nordson Corporation Increases Dividend 19 Percent for Fourth Quarter of Fiscal Year 2011

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/nordson-corporation-increases-dividend-19-percent-for-fourth-quarter-of-fiscal-year-2011

. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes

ASYMTEK Products | Nordson Electronics Solutions

Application of SMT technology in EMS industry - I.C.T SMT Machine

| https://www.smtfactory.com/Application-of-SMT-technology-in-EMS-industry-id45846537.html

Application of SMT technology in EMS industry - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español Français Hrvatski Italiano magyar Nederlands Polski

Application of SMT in the Medical Field - I.C.T SMT Machine

| https://www.smtfactory.com/Application-of-SMT-in-the-Medical-Field-id48301637.html

Application of SMT in the Medical Field - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español Français Hrvatski Italiano magyar Nederlands Polski Português Pусский românesc Slovenščina Suomalainen Türk dili Tiếng Việt العربية فارسی עִברִית 한국어 日本語

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing

Applications of SMT and THT Turnkey Solutions in the Aerospace Industry - I.C.T SMT Machine

| https://www.smtfactory.com/Applications-of-SMT-and-THT-Turnkey-Solutions-in-the-Aerospace-Industry-id63733027.html

. Applications of SMT Equipment in the Aerospace Industry (a) Miniature Component Assembly: SMT equipment enables precise placement of miniature components on printed circuit boards (PCBs

Addressing the Issues Around Solder Joint Voids in Surface Mount Components | EPTAC

| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/

. Review of IPC-A-610 criteria for BGA and SMT components. Samples of x-ray images and what they are saying to us. List of papers and studies on the topic for further review.   Course Length: 20 Minutes Cost: FREE Presenter(s

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing

The Role of PCB Assembly in the Internet of Things (IoT)

Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/

The Role of PCB Assembly in the Internet of Things (IoT) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications

Imagineering, Inc.

The Application of the Pin-in-Paste Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/cc?ID=te_news_industry,23962&url=_print

. The benefits of the pin-in-paste reflow process include: Use of the same SMT equipment for both SMT and TH components Elimination of hand and wave soldering processes Reduction of machine setup time Reduction of production turn around space and time