| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
. With a melting temperature of 441°F, NT100Ge is compatible with all wave and selective solder equipment. Similar to the effect of phosphorous in Sn63 alloys, the small addition of Germanium in NT100Ge serves as a de-oxidant, which keeps drossing to a minimum
| https://pcbasupplies.com/wp-content/uploads/2023/05/MSDS-BC-10.pdf
. Components CAS Number % HSIS TWA HSIS STEL Copper (Cu) 7440-50-8 Iron (Fe) 7439-89-6 7439-92-1 7440-36-0 Bismuth (Bi) 7440-69-9 Phosphorous (P) 7723-14-0 Zinc (Zn
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. The bond of this electroplating is usually not sufficient for screws. The better method, electroless nickel plating, gives an alloy of nickel with up to 15% phosphorous
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL
1 |