| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
| https://www.eptac.com/soldertips/acceptability-of-conformal-coating-bubbles/
) Courtesy of IPC-A-610 Standard Answer: The IPC-A-610 pictures are just there to provide some visual information on the condition being described, in this case the coverage from conformal coating application
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
| https://www.eptac.com/faqs/soldertips/soldertip/acceptability-of-conformal-coating-bubbles
) Courtesy of IPC-A-610 Standard Answer: The IPC-A-610 pictures are just there to provide some visual information on the condition being described, in this case the coverage from conformal coating application
