| http://etasmt.com/cc?ID=te_news_industry,24166&url=_print
: 1, incoming material inspection => PCB A screen printing solder paste => patch => dry => reflow soldering => plug-in, pin bent => flap => PCB B pasta plastic patch
| http://etasmt.com/te_news_industry/2021-09-01/24166.chtml
: 1, incoming material inspection => PCB A screen printing solder paste => patch => dry => reflow soldering => plug-in, pin bent => flap => PCB B pasta plastic patch
| http://etasmt.com:9060/te_news_industry/2021-09-01/24166.chtml
: 1, incoming material inspection => PCB A screen printing solder paste => patch => dry => reflow soldering => plug-in, pin bent => flap => PCB B pasta plastic patch
| http://etasmt.com:9060/te_news_industry/2013-04-20/3962.chtml
: 1, incoming material inspection => PCB A screen printing solder paste => patch => dry => reflow soldering => plug-in, pin bent => flap => PCB B pasta plastic patch
| https://www.feedersupplier.com/sale-14340849-30903901-automatic-insertion-machine-spare-parts-ai-shoot-pin-piston-lock-pin.html
30903901 Automatic Insertion Machine Spare Parts AI Shoot Pin Piston Lock Pin Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| http://www.feedersupplier.com/sale-14340849-30903901-automatic-insertion-machine-spare-parts-ai-shoot-pin-piston-lock-pin.html
30903901 Automatic Insertion Machine Spare Parts AI Shoot Pin Piston Lock Pin Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| http://etasmt.com/cc?ID=te_news_bulletin,7561&url=_print
The Difference Between SMT Line and DIP Line - Reflow Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
stays far away from the contact area, Pseudo soldering will be caused. The reason is that when solder is melting, pin temperature is higher than pad temperature. Improvement measures: Use more bottom heating (reflow oven with upper and lower heating modes
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. As of today, double-sided boards are generally soldered to the top (component side) by reflow, and then soldered to the bottom (pin side) by wave soldering. A current trend is toward double-sided reflow soldering, but there are still some problems with this process
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
between thermocouple and non-immersed surface, high endurance of several cycles of reflow soldering temperatures, bad operatability after curing, and difficult removal of residual adhesive. Suitable for continuously testing the fixed points. C. High-temp