| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Added moisture sensitive and process sensitive component usage – 3.8 Changed gold removal process - 4.5.1 Added heat shrinkable soldering devices - 4.19
| https://www.eptac.com/solder-tips/
: Wave Soldering Insufficient Fill and Voids in PTH There are many reasons for insufficient fill of a PTH (Plated Through Hole) and the occurrence of voids in barrels. Board thickness, finished hole size, board plating material, flux type and application
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
: This printed layer contains labels, symbols, and markings for components. Vias: Small holes drilled through the PCB, often plated with copper. Pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Excessive preheat can reduce flux effectiveness. Printing A process for transferring solder to a surface by forcing solder paste through a stencil or screen with a squeegee
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
. SMT can be combined with through-hole construction, if necessary, but customers should be aware that production set-up will be slightly slower since all holes have to be drilled before assembly
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. A technician does this by placing the layers onto an optical punch machine, which drives a pin down through the holes to align the PCB layers
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Viktoria Rawinski Abstract 31-2 Understanding the Higher Wire Bond Strength Advantage of Au/Pd/Au (IGEPIG) as Compared to Alternate Immersion Gold Finishes, Before and After Heat Treatment with Different Types of Wires Tatsushi Someya, Tetsuya Sasamura, Ph.D
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
pretinning a. The supplier shall remove gold from all surface areas to be joined by soldering. NOTE The central contact pin can be degolded and pretinned with a soldering iron by melting a short length of 63 Sn or 60 Sn solder wire
| https://unisoft-cim.com/cells-apparel.php
auditor through the paperless manufacturing flow we have developed using the CELLS Workflow MES Product Tracking Manufacturing Execution System software. With viewable Bills of Materials, assembly instructions, and product documentation we made a definite
| https://unisoft-cim.com/cells.php
be tracked to schedule preventive maintenance. Efficiency: Cycle times can be improved and idle time reduced with real-time information and analysis. Manufacturing capacity and efficiency can be increased through reductions in rework and scrap. On time
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