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, consistent layer of NC 21T20 solder paste sticks to the component. This technique is useful in applying solder to products that do not lend themselves to printing or dispensing, such as pin arrays. Low-void IPC-7097A is the Specification for the Design and
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Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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manufacturing process, the creation of the perfect solder joint. So many factors enter into this process, but there is one that is constantly discussed in every specification and standard, that even though we do not see it with the unaided eye, is critical to
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Solder Joint Goals - Take II - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login Solder Joint Goals - Take II
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, we’ve heard it before, but the answer is, we have to adapt. We have to improvise. So what do we do? We changed the specification to state that if the solder balls are entrapped in something and they are not going to move, or go anywhere, then they are ok