| http://etasmt.com/cc?ID=te_news_industry,3361&url=_print
. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Based on medical endoscope technology, it is perfect for ultra fine pitch devices such as fine wire bonds or very small geometries such as micro bumps and copper pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types-2020/wire-pull
für Annahme- oder Ablehnungskriterien. Anwendungen mit kleinen Geometrien (Ultra Fine Pitch) werden immer beliebter. Daher bietet Nordson DAGE
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
for a variety of component types including: QFP's, SOICs, SOTs, MELFs, Diodes, chips resistors and capacitors, including 10 mil fine pitch and 0402s
| http://etasmt.com/te_news_industry/2013-03-23/3361.chtml
. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Clouthier, AMTX "SMT Printing Process for Fine and Ultra Fine Pitch" 1996: Dr. Randy D. Schueller, 3M, Electronic Products Division "Reliability Results For A Wire Bondable Tape Ball Grid Array Package (TBGA)" 1995: Thomas S. Tarter, AMD; Martin P
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/wire-pull
). Nordson DAGE bondtesters fully conform to or exceed these standards. The standards contain specifications for acceptance or rejection criteria. Small geometry (Ultra Fine Pitch
| https://www.eptac.com/class/advanced-micro-smt-hand-soldering/
of small, surface mount components in either placement or rework of, this is the course for you. This two (2) day Advanced Surface Mount Micro Hand Soldering program focuses on the proper techniques for placement, soldering, and rework of fine pitch surface mount components such as chip components ranging in
ASCEN Technology | https://www.ascen.ltd/Products/raidal_lead_former/1078.html
elements,which packed by in bulk or tape type. Features: 1.High productivity auto forming and cutting in one time,Automatic feeding,cutter,forming,automatic discharging can complete all actions once,Speed control of the non-phase fine adjustment of transducer. 2
